1
The right iron tip matters. Use a fine chisel or conical tip — 1–2mm. The common mistake is using a tip that's too small, which loses heat and causes cold joints.
2
Flux is not optional. Apply no-clean flux paste to the pads before placing components. It's the difference between SMD work being frustrating and being straightforward.
3
Tack one side first. For resistors and capacitors, tack one pad, place the component with tweezers while keeping tension, then solder the second pad. Then go back and reflow the first.
4
Drag soldering for IC chips. Apply flux to all pins. Tin one corner pin to hold the chip. Then drag a flux-coated tip across the remaining pins in one smooth pass. Bridges clean up with wick.
5
Solder wick is your best friend. Saturate wick in flux, press to bridges, apply iron. Bridges vanish. Don't press too hard or too long — lifted pads are worse than bridges.
6
Visual inspection. Use a loupe or USB microscope. Every joint should be shiny and volcano-shaped. Dull, grainy, or balled joints on SMD work cause the same failures as on through-hole — they're just harder to see.